RRP Electronics Signs Four Strategic MoUs at Semicon India 2025.

At the Semicon India 2025 conference in New Delhi, RRP Electronics Ltd signed four pivotal Memorandums of Understanding (MoUs) to enhance India’s semiconductor ecosystem.

      - The MoU with TIFR focuses on collaborating for the HGCAL project (an upgrade of the CMS experiment at CERN, Geneva), showcasing RRP’s advanced OSAT (Outsourced Semiconductor Assembly & Test) capabilities.

      - A partnership with Polaron Infotech aims to fortify the semiconductor supply chain with cybersecurity, safeguarding intellectual property and ensuring operational continuity.

      - Collaboration with Rajarambapu Institute of Technology (RIT), Sangli will nurture talent through industry-aligned curricula, hands-on training, and internships or employment opportunities at RRP Electronics.

Main Point :-   (i) The MoU with MONK9 Tech Pvt Ltd enables RRP Electronics to extend its advanced semiconductor packaging technology and infrastructure support to MONK9’s upcoming projects.

      (ii) Collectively, the four MoUs are expected to generate ₹15 crore in cumulative revenues, alongside driving skill development, innovation, and professional education in the semiconductor domain.

(iii) These collaborations align with India’s broader semiconductor ambition—"Designed in India, Made in India, Trusted by the World"—and position RRP as a strategic enabler of the domestic semiconductor value chain.